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Pb-FREE SOLDERS AND OTHER JOINING MATERIALS FOR POTENTIAL REPLACEMENT OF HIGH-Pb HIERARCHICAL SOLDERS

TitlePb-FREE SOLDERS AND OTHER JOINING MATERIALS FOR POTENTIAL REPLACEMENT OF HIGH-Pb HIERARCHICAL SOLDERS
Publication TypeJournal Article
Year of Publication2018
AuthorsAnderson, IE, Choquette, S, Reeve, K, Handwerker, C
Journal2018 Pan Pacific Microelectronics Symposium
Date Published03
ISBN Number978-1-9445-4304-4
Accession NumberWOS:000432251800041
Keywordsalloys, cu6sn5, fluidity length, high temperature interconnects, high-Pb solder, interfacial reactions, lead-free solder, liquid, ni, Pb-free solder, phase diffusion bonding, phase-stability, zn-sn
Abstract

with paste may substitute for applying an array of solder spheres for BGA applications. This paper will review examples of the competing high-temperature interconnect methods and their potential for practical application in the electronics industry.

DOI10.23919/PanPacific.2018.8319020
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