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Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

TitleNucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys
Publication TypeJournal Article
Year of Publication2015
AuthorsReeve, KN, Anderson, IE, Handwerker, CA
JournalJournal of Electronic Materials
Volume44
Pagination842-866
Date Published03
Type of ArticleArticle
ISBN Number0361-5235
Accession NumberWOS:000349442100011
Keywordsaluminum, Cu-Al IMC particles, cu6sn5, joints, lead-free solders, ni, nucleation, orientation, phase-equilibria, reliability, stability, system, thermodynamic assessment, Thermodynamics, tin-lead
Abstract

ing temperature was reduced from 1200A degrees C to 800A degrees C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

DOI10.1007/s11664-014-3551-1
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