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Effect of Temperature on the Nano/Microstructure and Mechanical Behavior of Nanotwinned Ag Films

TitleEffect of Temperature on the Nano/Microstructure and Mechanical Behavior of Nanotwinned Ag Films
Publication TypeJournal Article
Year of Publication2015
AuthorsZhang, H, Geng, J, Ott, RT, Besser, M, Kramer, MJ
JournalMetallurgical and Materials Transactions a-Physical Metallurgy and Materials Science
Date Published09
Type of ArticleArticle
ISBN Number1073-5623
Accession NumberWOS:000358939600034
Keywordsboundaries, copper, cu, grain rotation, nanoscale, size, strain, thin-films, ultrahigh-strength

In situ and ex situ annealed nanotwinned (NT) Ag thin films have been investigated by TEM and tensile testing to reveal the thermal stability of the twin boundaries, grain boundaries, dislocation densities, and their respective influence of the macroscopic yield stress. The NT Ag films synthesized by magnetron sputtering form both coherent (CTB, I 3{111}) pound and incoherent (ITB, I 3{112}) pound twin boundaries that are thermally stable up to 473 K (200 A degrees C), i.e., no obvious changes in grain size, twin spacing, and yield stress. In situ TEM observations show the dislocations become mobile at 453 K (180 A degrees C) resulting in dislocation annihilation primarily at twin and grain boundaries. Rotation of grains with low-angle grain boundaries was observed during in situ heating, resulting in the growth of columnar grains above 453 K (180 A degrees C). However, no noticeable changes in the spacings of CTBs were observed during the entire in situ and the ex situ annealing [up to 873 K (600 A degrees C)]. The increase in grain size and concomitant decrease in yield stress following annealing at various temperatures can be described by the Hall-Petch relationship, demonstrating that grain size rather than twin spacing is most sensitive to thermal annealing and plays a dominant role in the deformation of NT Ag films.

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