Vacancies, twins, and the thermal stability of ultrafine-grained copper

TitleVacancies, twins, and the thermal stability of ultrafine-grained copper
Publication TypeJournal Article
Year of Publication2011
AuthorsSaldana C, King AH, Stach EA, Compton WD, Chandrasekar S
Journal TitleApplied Physics Letters
Volume99
Pages231911
Date Published12
Type of ArticleArticle
ISBN Number0003-6951
Accession NumberWOS:000298006100028
Keywordsboundaries, CU, metal, nanoscale, PLASTIC-DEFORMATION, recrystallization temperature, stored energy
Abstract

Ultrafine-grained metals have impressive strength but lack the thermal stability necessary for most applications. Nano-scale, deformation twinned copper microstructures exhibit a rare combination of strength and stability. While storing less energy in their interfaces than other nanostructured metals, they also exhibit lower vacancy supersaturations, reducing the driving force and mobility for microstructure evolution. From a thermal stability perspective, the nano-twinned microstructure may thus be preferred over the more commonly produced nano-scale equiaxed microstructures. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3669404]

URL<Go to ISI>://WOS:000298006100028
DOI10.1063/1.3669404
Alternate JournalAppl. Phys. Lett.