Thermal stability and strength of deformation microstructures in pure copper

TitleThermal stability and strength of deformation microstructures in pure copper
Publication TypeJournal Article
Year of Publication2012
AuthorsSaldana C, King AH, Chandrasekar S
Journal TitleActa Materialia
Volume60
Pages4107-4116
Date Published06
Type of ArticleArticle
ISBN Number1359-6454
Accession NumberWOS:000306385200007
Keywordsboundaries, CU, Deformation twinning, evolution, MECHANICAL-BEHAVIOR, Nanocrystalline Cu, nanoscale, nanostructured metals, recrystallization temperature, severe plastic deformation, stored energy, strain, Ultrafine-grained (UFG) microstructure, ultrahigh-strength
Abstract

The plastic flow field produced by machining is utilized to access a range of deformation parameters in pure copper: strains of 1-7, strain rates of 1-1000 s(-1) and temperatures as low as 77 K. The strength and stability of the severe plastic deformation microstructures including cellular, elongated, equiaxed and twinned types are characterized. Unique combinations of strengthening and stability are identified in the case of heavily twinned microstructures. These observations offer insights for improving the stability of both single-phase and multicomponent ultrafine-grained alloys. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

URL<Go to ISI>://WOS:000306385200007
DOI10.1016/j.actamat.2012.04.022
Alternate JournalActa Mater.