A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper

TitleA study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper
Publication TypeJournal Article
Year of Publication2009
AuthorsBrown TL, Saldana C, Murthy TG, Mann JB, Guo Y, Allard LF, King AH, Compton WD, Trumble KP, Chandrasekar S
Journal TitleActa Materialia
Volume57
Pages5491-5500
Date Published10/01
ISBN Number1359-6454
Accession NumberISI:000271346100018
Keywordscopper, dynamic recrystallization, evolution, high speed deformation, nanostructured metal, refinement, severe plastic deformation, ultrafine grained microstructure
Abstract

The deformation field in machining was controlled to access a range of deformation parameters-strains of 1-15, strain rates of 10-100,000 s(-1) and temperatures of up to 0.4 T-m-in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000 s(-1) at -196 degrees C and at strain rates of >= 10,000 s(-1) even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener-Hollomon parameter. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

URL<Go to ISI>://000271346100018
DOI10.1016/J.Actamat.2009.07.052