Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies

TitleForeword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies
Publication TypeJournal Article
Year of Publication2010
AuthorsLin KL, Kang SK, Duh JG, Lee A, Bieler T, Turbini L, Sidhu R, Guo F, Anderson I
Journal TitleJournal of Electronic Materials
Volume39
Pages2503-2503
Date Published12
ISBN Number0361-5235
Accession NumberISI:000283509000001
URL<Go to ISI>://000283509000001
DOI10.1007/S11664-010-1389-8
Alternate JournalJ Electron Mater